Why do silicon wafer cutting fluids use defoamers?

　　We know that silicon wafer cutting fluid is required during the cutting process, but do you know why silicon wafer cutting fluid requires defoamer? Silicon wafer cutting fluid is a commonly used processing fluid in the silicon wafer processing industry, which has good suspension, dispersion, lubrication and cooling performance, as well as stable quality indicators. However, when cutting or cleaning silicon wafers, a large amount of foam is often produced, which seriously affects the cutting efficiency, resulting in excessive consumption of cutting fluid and rising costs. Therefore, manufacturers usually use silicon chip cutting fluid defoamer to solve the foam problem.

　　So why does the silicon wafer cutting fluid bubble during use?

　　A lot of additives are used in the production and processing of silicon chips. The mixing of various additives usually leads to chemical instability. Slight stirring, shaking, and cutting will lead to the generation of foam; Due to the high-speed operation of the machine, a large amount of air enters and bubbles are easily generated. The defoamer for silicon wafer cutting fluid is specifically developed for this situation.

　　The hazards of foaming in silicon wafer cutting fluid:

　　The foam produced by silicon chip cutting fluid seriously affects the operation of production and processing equipment. Over time, it can also damage mechanical equipment and affect its service life; Foam will cause the quality of products produced to fail to meet the standards, affecting customer trust; Foam will also slow down the progress of production and processing, leading to an increase in production costs, which manufacturers do not want to see

　　The defoamer for silicon wafer cutting fluid is made of special polyether modified by a special process, which is easily soluble in water. It is particularly suitable for continuous defoaming and foam suppression under high temperature, strong acid, strong alkali, high shear force, and high pressure conditions.